Tue, 05 Nov

Two-day summit unites innovators, visionaries, and industry leaders for in-depth discussions on how Ethernet and AI are shaping the future of intelligent networks and applications

TEF 2024: Exploring Ethernet's Future in the Age of AI

Laurie Davis
Interprose for Ethernet Alliance
+1 804 337 2569
Laurie_Davis@interprosepr.com

The Ethernet Allia

nce, a global consortium dedicated to the continued success and advancement of Ethernet technologies, today shared details of its upcoming Technology Exploration Forum (TEF 2024): Ethernet in the Age of AI. This pivotal event will explore how Ethernet is adapting to the demands of Artificial Intelligence (AI) and play host to meaningful discussions that will shape the future of both technologies.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240905759105/en/

Registration and agenda are now live for Ethernet Alliance's Technology Exploration Forum: Ethernet in the Age of AI. The event will be held October 22-23, 2024 at the Santa Clara Convention Center. (Graphic: Business Wire)

Registration and agenda are now live for Ethernet Alliance's Technology Exploration Forum: Ethernet in the Age of AI. The event will be held October 22-23, 2024 at the Santa Clara Convention Center. (Graphic: Business Wire)

Event Highlights:

Keynote Speakers:

  • Moray McLaren, Principal Engineer, Google
  • Nicolaas (Nic) Viljoen, AI Systems Engineer, Meta
  • Ram Huggahalli, Principal Hardware Engineer – Strategic Planning and Architecture, Microsoft

Event Overview:

TEF 2024: Ethernet in the Age of AI offers an in-depth exploration of how Ethernet and AI are intersecting to drive innovation, enhance connectivity, and influence the development of intelligent networks and applications. Key topics include:

  • Emerging synergies between Ethernet and AI
  • AI networks and network topologies
  • Impact of the Physical Layer on AI network performance
  • Future trends and technologies shaping Ethernet and AI
  • Latency, power, and efficiency requirements for AI networks

Why Attend:

  • Exclusive Insights: Gain valuable perspectives from top experts about the integration of Ethernet and AI, and its global impacts on business, industry, and users.
  • Provocative Discussions: Participate in dynamic sessions covering the latest advancements and future directions of Ethernet technologies in the context of AI.
  • Networking Opportunities: Connect with industry leaders, practitioners, and technologists to exchange ideas and explore collaborative opportunities.

Event Sponsorship:

Sponsor support plays a vital role in the success of TEF 2024: Ethernet in the Age of AI, facilitating high-caliber discussions, insightful keynote presentations, and valuable networking opportunities. Sponsorship offers an avenue for engaging with key stakeholders and taking an active role in shaping the future of Ethernet and AI technologies, while also enhancing brand visibility and demonstrating commitment to innovation in a rapidly evolving industry.

“Cisco’s participation in TEF 2024 helps us stay active and engaged with industry peers to shape future Ethernet standards and develop high-performance solutions that meet the evolving demands of AI/ML, ensuring our customers receive cutting-edge, interoperable solutions,” said Sai Gopalakrishnan, Director, Technical Marketing, Provider Connectivity Group, Cisco.

“We're eagerly anticipating TEF, confident that it will be an exceptional event. With its focus on promoting Ethernet for the age of AI, we're excited to see the insights and innovations that will emerge. TEF is poised to be a key platform for driving the future of AI and networking,” said Keyi Zhu, Head of Datacom Standards, Huawei.

“The SNIA SFF Technology Affiliate Technical Work Group (SFF TA TWG) hopes to gain insight into how the increased storage and networking needs driven by the future of AI is shaping the interconnect specification requirements that the industry needs to enable technology advancements”, said Paul Coddington, Co-Chair, SNIA SFF TA TWG.

Representing a cross-section of the Ethernet ecosystem, current sponsors include Platinum Sponsors Cisco Systems Inc. (NASDAQ:CSCO); Huawei Technologies Co., Ltd.; and SNIA SFF Technology Affiliate (TA) Technical Work Group (TWG); Gold Sponsors Amphenol Corporation (NYSE:APH); Arista Networks, Inc. (NYSE: ANET); Juniper Networks, Inc. (NYSE:JNPR); The Siemon Company; and TE Connectivity Ltd. (NYSE: TEL); Giveaway Sponsors EXFO Inc.; Spirent Communications plc (LSE:SPT); and Associate Sponsors Optical Internetworking Forum (OIF); Open Compute Project; Ultra Ethernet Consortium (UEC); Dell’Oro Group, Inc.; 650 Group LLC; and LightCounting Market Research.

For more information regarding sponsorship opportunities, please visit https://bit.ly/EATEF24-Sponsorship or contact Morgan Fricke.

Learn more about TEF 2024: Ethernet in the Age of AI now at https://bit.ly/EATEF24MediaAlert. For real-time updates, follow @EthernetAllianc on X, Facebook, or LinkedIn.

About the Ethernet Alliance

The Ethernet Alliance is a global consortium that includes system and component vendors, and industry experts who are committed to the continued success and expansion of Ethernet technology. The Ethernet Alliance takes Ethernet standards to market by supporting activities that span from incubation of new Ethernet technologies to interoperability demonstrations and education. The organization’s plans may be found on the Events page of its website.


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